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NP82N04PDG
TAPE INFORMATION
There are two types (-E1, -E2) of taping depending on the direction of the device.
Draw-out side
MARKING INFORMATION
NEC
82N04
DG
Pb-free plating marking
Abbreviation of part number
Lot code
Reel side
RECOMMENDED SOLDERING CONDITIONS
The NP82N04PDG should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, please contact an NEC Electronics
sales representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Soldering Method
Infrared reflow
Partial heating
Soldering Conditions
Maximum temperature (Package's surface temperature): 260 ° C or below
Time at maximum temperature: 10 seconds or less
Time of temperature higher than 220 ° C: 60 seconds or less
Preheating time at 160 to 180 ° C: 60 to 120 seconds
Maximum number of reflow processes: 3 times
Maximum chlorine content of rosin flux (percentage mass): 0.2% or less
Maximum temperature (Pin temperature): 350 ° C or below
Recommended
Condition Symbol
IR60-00-3
P350
Time (per side of the device): 3 seconds or less
Maximum chlorine content of rosin flux: 0.2% (wt.) or less
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet D18396EJ1V0DS
7
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